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高級硬件工程師英文簡歷表格
在編寫個(gè)人簡歷之前需要目標(biāo)企業(yè)進(jìn)行調(diào)查了解，首先要知道的信息就是企業(yè)招聘的職位有哪些。一些大企業(yè)招聘通常會只有一個(gè)職位、崗位，求職者編寫個(gè)人簡歷要有針對的目標(biāo)，其目標(biāo)職位要是在招聘的職位范圍內(nèi)。
企業(yè)中的職務(wù)有好很多，能提供給求職者的崗位要根據(jù)其個(gè)人專業(yè)以及才能而來，不同的職務(wù)責(zé)任不同、工作任務(wù)不同，在編寫個(gè)人簡歷之前要知道你所應(yīng)聘的職位是做什么工作的，針對這樣的工作你具有怎樣的優(yōu)勢。同時(shí)，還需要了解該職務(wù)招聘的條件要求，諸如對學(xué)歷的要求、對專業(yè)的要求，還有對技能的要求等等。
最后在職人員在對目標(biāo)企業(yè)的信息了解上，還應(yīng)該包括有企業(yè)的文化特點(diǎn)以及企業(yè)產(chǎn)品，企業(yè)的文化特點(diǎn)關(guān)系對方篩選簡歷的風(fēng)格，還有所欣賞人才的類型。企業(yè)產(chǎn)品信息在求職簡歷中同樣可作為一個(gè)參考的材料，畢竟以后的工作都是圍繞產(chǎn)品展開。
| Name： yjbys | Hukou：Shanghai | |||||
| Residency：Shanghai | Work Experience： | |||||
| Current Salary： | Tel： | |||||
| E-mail：www.ruiwen.com/jianli | ||||||
| Career Objective | ||||||
| Desired Industry： | Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification | |||||
| Desired Position： | Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff | |||||
| Desired address： | Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao | Desired Salary： | Negotiable | |||
| Work Experience | ||||||
| 20xx/06—Present | ***Company | |||||
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Industry: Electronics/Semiconductor/IC Intel Flash Engineering Department Individual Contributor Responsibilities： I have been working in Intel Flash Assembly & Test Engineering Department as an Individual Contributor since June of 20xx. Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
Reference: Bao Powel Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
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| 20xx/01—20xx/05 | Intel(Shanghai) Technology Development Ltd. Company | |||||
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Industry: Electronics/Semiconductor/IC Intel STTD-China Department Electronics Development Engineer Responsibilities：
Reference: Bao Powel Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 20xx. Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle. |
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| 20xx/05—20xx/01 | Nanyang University of Science & Technology | |||||
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Industry: Electronics/Semiconductor/IC Electronics & Electrical Engineering Department Research Fellow Responsibilities：
Subordinate: 3 Reference: Patrick Low Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job. Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself. |
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| Project Experience | ||||||
| 20xx/01—Present | Assembly NPI (New Product Introduction) | |||||
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Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it. Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress. |
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| 20xx/01—20xx/12 | Marginal Electrical Boards Rescue | |||||
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Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally. Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress. |
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| 20xx/10—20xx/05 | Optimization the current Test Process Order for Flash Memory | |||||
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Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me. Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement. |
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| 20xx/05—20xx/12 | Test Yield of Flash memory Improvement | |||||
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Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen. Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up. |
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| Education and Training | ||||||
| 20xx/05—20xx/01 | Nanyang University of Science & Technology Microelectronics Doctorate | |||||
| I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration. | ||||||
| 20xx/03—20xx/03 | Seoul National University of Korea Microelectronics Others | |||||
| I had been working in National Physical Lab of Seoul National University in Korea since March of 20xx to March of 20xx as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology. | ||||||
| 20xx/03—20xx/03 | Shanghai Institute of Microsystems and Information Technology，Chinese Academy of Sciences Information Technology Doctorate | |||||
| 20xx/09—20xx/03 | Nanjing University of Science & Technology Material Science and Engineering Master | |||||
| Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics. | ||||||
| 20xx/09—20xx/07 | Nanjing University of Science & Technology Material Science and Engineering Bachelor | |||||
| 20xx/07—20xx/07 | Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department | |||||
| Professional Skills | ||||||
| Language Skills： |
English: EXCELLENT Korean: AVERAGE |
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| Computer Skills： |
Technology skilled 96Month SAP understanding 8Month |
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| Certificate： |
20xx/11 MCSE 20xx/06 CET6 |
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| Self-appraisal | ||||||
| 7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model. | ||||||
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